姓名：陈强

职称：讲师

邮箱：13548774386@163.com

个人基本情况

陈强（Chen Qiang，Lecturer），1991年生，山东临沂人，讲师，博士生（后）。主要从事电子封装材料力热耦合机理研究。2023年毕业于国防科技大学空天科学学院并从事博士后研究工作；以第一作者身份和通讯作者发表SCI论文10余篇，其中含Advanced Composites and Hybrid Materials、Composites Part B、Defence Technology等顶级期刊。

主要研究方向

3C电子产品封装材料制备工艺与市场化应用

大功率半导体器件电子封装材料工艺研发与性能研究

先进复合材料成型工艺与控制工程

开设课程

画法几何与机械制图（1）

近年的科研项目、专著与论文、专利、获奖

代表性著作：

[1] Chen Q, Huang J, Liu F.Q, Li D.K, Cai M.H, Ye Y.C. Thermomechanical response of diamond  reinforced  metal  matrix  composites  [J]. Advanced  Composites and Hybrid Materials, 2026,9(2):157. (中科院SCI一区top).

[2] Chen Q, Huang J, Li D.K, Ye Y.C., Bai S.X. The thermomechanical coupling and multiscale correlation mechanism of Cf/C-SiC composites reinforced with chopped carbon fibers [J]. Composites Part B: Engineering, 2026, 315(15): 113513-113532. (中科院SCI一区top).

[3] Chen Q, Huang C.M., Li S., Bai S.X., Huang J., Li D.K., Ye Y.C. Thermomechanical response of diamond/Cu for military electronic devices [J]. Defence Technology, 2026. Doi:10.1016/j.dt.2026.03.001 (中科院SCI一区).

[4] Chen Q, Zhao F, Jia J, Zhu C, Bai S, Ye Y. Multiscale simulation of elastic response and residual stress for ceramic particle reinforced composites [J]. Ceramics International, 2022, 48(2): 2431-2440.

[5] Chen Q, Zhu L, Bai S.X., Ye Y.C. Preparation and properties of highly thermal conductive C/C-SiC[J]. Materials Today Communications, 2023, 36: 106595.

[6] Chen Q, Liu L, Zhu C, Chen K.. Mesomechanical modeling and numerical simulation of the diffraction elastic constants for Ti6Al4V polycrystalline alloy [J]. Metals, 2018, 8(10):822.

[7] Ye Y.C., Ni Z.Q., Huang C.M, Bai S.X, Chen Q(通讯). Constitutive model of elastic response for Fe-TiB2 Composites [J]. Materials Today Communications, 2022, 33: 104620.

[8] Liu L, Chen Q, Zhu C, Chen K. A new model for evaluating the diffraction elastic constants of WC-Co [J]. Materials Science and Technology.

[9] Jia J, Li C, Chen Q, Bai S.X., Chang J, Xiong D, Gao M, Li S, Xiao J. Effects of SiC content on the mechanical and thermophysical properties of 3D Cf/SiC-Al composites[J].Ceramics International, 2022, 48(14): 20571-20578.

[10] Huang J, Li Y, Yu X, Liu Z, Wang F, Yue Y, Zhang R, Dai R, Yang K, Liu H, Fan Q, Hong D, Chen Q, Wang Z, Gao Y, Xin G. Improved Thermal Dissipation in a MoS2 Field-Effect Transistor by Hybrid High- k Dielectric Layers[J]. ACS Applied Materials & Interfaces, 2024, 16(45): 62527-62536.

（责编/王荣荣 初审/李罗娜 终审/周勇）